2006 Volume 15 Issue 1
Article Contents

Ma Xiao-Hua, Hao Yue, Sun Bao-Gang, Gao Hai-Xia, Ren Hong-Xia, Zhang Jin-Cheng, Zhang Jin-Feng, Zhang Xiao-Ju, Zhang Wei-dong. 2006: Fabrication and characterization of groove-gate MOSFETs based on a self-aligned CMOS process, Chinese Physics B, 15(1): 195-198.
Citation: Ma Xiao-Hua, Hao Yue, Sun Bao-Gang, Gao Hai-Xia, Ren Hong-Xia, Zhang Jin-Cheng, Zhang Jin-Feng, Zhang Xiao-Ju, Zhang Wei-dong. 2006: Fabrication and characterization of groove-gate MOSFETs based on a self-aligned CMOS process, Chinese Physics B, 15(1): 195-198.

Fabrication and characterization of groove-gate MOSFETs based on a self-aligned CMOS process

  • Available Online: 30/01/2006
  • Fund Project: the National Natural Science Foundation of China (Grant 60376024)
  • N and P-channel groove-gate MOSFETs based on a self-aligned CMOS process have been fabricated and characterized. For the devices with channel length of 140nm, the measured drain induced barrier lowering (DIBL) was 66mV/V for n-MOSFETs and 82mV/V for p-MOSFETs. The substrate current of a groove-gate n-MOSFET was 150 times less than that of a conventional planar n-MOSFET. These results demonstrate that groove-gate MOSFETs have excellent capabilities in suppressing short-channel effects. It is worth emphasizing that our groove-gate MOSFET devices are fabricated by using a simple process flow, with the potential of fabricating devices in the sub-100nm range.
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通讯作者: 陈斌, bchen63@163.com
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    沈阳化工大学材料科学与工程学院 沈阳 110142

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Fabrication and characterization of groove-gate MOSFETs based on a self-aligned CMOS process

Abstract: N and P-channel groove-gate MOSFETs based on a self-aligned CMOS process have been fabricated and characterized. For the devices with channel length of 140nm, the measured drain induced barrier lowering (DIBL) was 66mV/V for n-MOSFETs and 82mV/V for p-MOSFETs. The substrate current of a groove-gate n-MOSFET was 150 times less than that of a conventional planar n-MOSFET. These results demonstrate that groove-gate MOSFETs have excellent capabilities in suppressing short-channel effects. It is worth emphasizing that our groove-gate MOSFET devices are fabricated by using a simple process flow, with the potential of fabricating devices in the sub-100nm range.

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